E-MAIL : yun7@swf.co.kr
Research Project Achievement
Ministry | Title | Research period | Budget | Noe |
---|---|---|---|---|
MOTIE | Development of high-speed plating equipment on wafer and glass | 1997.11.~1998.10. | 121M | Success |
MOTIE | Development of Cu and Au plating solution for semiconductor wafer metal wiring with the theme of metal salt |
1999.08.~2001.07 | 244M | Success |
MOTIE | Development of plating solution and plating equipment for semiconductor copper metal wiring on 8 inch wafer |
2001.06.~2002.05 | 373M | Success |
SMBA | Development of CA cathode plate for electrode electrolyzer 발 | 2001.07.~2003.11 | 182M | Success |
Sung Won Forming | Development of CA cathode plate for electrode electrolyzer | 2001.08.~2002.11 | 155M | Success |
SMBA | Technology development from manual plating JIG assembly process to automatic insertion JIG assembly process | 2015.12.~2016.11 | 99M | Success |
TIPA |
Design/production of reconfigurable coupling level CROSS GUIDE coupler for 5G communication | 2018.06.~2019.05 | 97M | Success |