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  • Research Project Achievement
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    고객님의 방문을 환영합니다.

    Research Project Achievement

    Ministry Title Research period Budget Noe
    MOTIE Development of high-speed plating equipment on wafer and glass 1997.11.~1998.10. 121M Success
    MOTIE

    Development of Cu and Au plating solution for semiconductor wafer metal wiring with the theme of metal salt

    1999.08.~2001.07 244M Success
    MOTIE

    Development of plating solution and plating equipment for semiconductor copper metal wiring on 8 inch wafer

    2001.06.~2002.05 373M Success
    SMBA Development of CA cathode plate for electrode electrolyzer 발 2001.07.~2003.11 182M Success
    Sung Won Forming  Development of CA cathode plate for electrode electrolyzer 2001.08.~2002.11 155M Success
    SMBA Technology development from manual plating JIG assembly process to automatic insertion JIG assembly process 2015.12.~2016.11 99M Success

    TIPA

    Design/production of reconfigurable coupling level CROSS GUIDE coupler for 5G communication 2018.06.~2019.05 97M Success