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    • BUSINESS

    홈페이지를 방문해주셔서 감사합니다.

    BUSINESS

    CONTACT US +82-31-495-2705~6

    E-MAIL : yun7@swf.co.kr

    Equipment Service

    주요사업내역을 안내해드립니다.

    Plating Machine
    • Plating Machine
    • Automated Developer
    • Bump Plater
    • Teflon Heater
    • Wafer Jig
    Plating Machine
    • 사업영역 Rotating Type Electro Plating Machine
    • 사업영역 12” Wafer Plating Machine (AUTO)
    • 사업영역 Electro Plating Machine (SEMI AUTO)
    사업영역

      Features

    • Wafer, Glass, MEMS, Stamper, NANO Structure, Electro Plating
    • Custom size for silicon and glass wafers
    • Cathode rotational plating system
    • Industrial PC control with large Flat panel display
    • Easy operator interface
    • All digital control system

    Specification

    Equipment Dimensions 1000(W) X 1200(D) X 1800(H) mm
    Total Solution Volume 100~200 liter X 1Cell
    Heater 3kw, 2EA
    Cell 1

    Each Cel

    Pump 1HP
    Rectifier 10VDC, 10A ~, Switch mode, Digital control
    Filtration 2 stage
    Pre-Filter 2 to 5 micron, 10inch Cartridge Type
    End Filter 0.2 to 0.5 micron, 10inch Cartridge Type
    Flow 40 liters~60 liters/min max. (adjustable)
    Automotive Developer

    • 사업영역 Panel Automotive Developer
    • 사업영역 Spray type
    • 사업영역 Puddle Type
    Bump Electroplating Machine

    사업영역

    Bump Plating Machine
    Teflon Heater

    • 사업영역 Teflon Heater
    • 사업영역 Teflon Heater
    Wafer Plating Jig

    • 사업영역 4~8 inch Wafer Plating Jig
    • 사업영역 12 inch Ceramic Jig
    • 사업영역 12 inch Ceramic Jig