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  • Electroplating & Electroforming
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    BUSINESS

    CONTACT US +82-31-495-2705~6

    E-MAIL : yun7@swf.co.kr

    Electroplating & Electroforming

    주요사업내역을 안내해드립니다.

    Wafer Plating
    • Application : Semiconductor system
    • Precursor : Au, Ni, Cu, Ag, Sn, Ni-Co
    • Type : 4~12 inch (Customizable)

    Mems (Micro Electro Mechanical System)
    • Application : Stamper, Precision component , Nozzel (<5um), Mesh, Probe card needle
    • Precursor : Au, Ni, Cu, Ag, Sn, Ni-Co

    • 사업영역 Stamper
    • 사업영역 Probe Card Needle
    • 사업영역 Nozzel(<5um)
    Precision Component
    • Application : Products requiring ultra-precision (nuclear fusion parts and satellite parts)
    • Precursor : Au, Ni, Cu, Ag, Sn, Ni-Co

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